M. Ciappa: search on Z-Library

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1

Overstress and electrostatic discharge in CMOS and BCD integrated circuits

G. Meneghesso, M. Ciappa, P. Malberti, L. Sponton, G. Croce, C. Contiero, E. Zanoni

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 761 KB

english, 2000

2

[IEEE 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - Phoenix, AZ, USA (2007.04.15-2007.04.19)] 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - Reliability of High-Power IGBT Modules for Traction Applications

Ciappa, Mauro, Castellazzi, Alberto

Year:

2007

Language:

english

File:

PDF, 7.45 MB

english, 2007

3

[IEEE 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - New Orleans, LA, USA (2020.3.15-2020.3.19)] 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - A Novel Mixed Planar litz Transformer for high frequency active clamp flyback converters

Ursino, Mario, Saggini, Stefano, Specogna, Ruben, Bianco, Alberto, Ciappa, Francesco, Scappatura, Giuseppe

Year:

2020

File:

PDF, 3.48 MB

2020

4

A new two-dimensional TCAD model for threshold instability in silicon carbide MOSFETs

Kikuchi, Takuo, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.07 MB

english, 2013

5

Lifetime prediction on the base of mission profiles

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 985 KB

english, 2005

6

A new built-in screening methodology to achieve zero defects in the automotive environment

Vezio Malandruccolo, Mauro Ciappa, Hubert Rothleitner, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 627 KB

english, 2009

7

Thermal component model for electrothermal analysis of IGBT module systems

Chan-Su Yun,, Malberti, P., Ciappa, M., Fichtner, W.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 237 KB

english, 2001

8

Selected failure mechanisms of modern power modules

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 613 KB

english, 2002

9

Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications

H. Yabuhara, M. Ciappa, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2001

File:

PDF, 322 KB

2001

10

Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles

M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada, Y. Nishibe

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 3.29 MB

english, 2005

11

Quantification of scanning capacitance microscopy measurements for 2D dopant profiling

P. Malberti, L. Ciampolini, M. Ciappa, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 406 KB

english, 2000

12

Reliability issues in power electronics

Iannuzzo, Francesco, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 194 KB

english, 2016

13

Asymmetric catalysis in fragrance chemistry: a new synthesis of Galaxolide®

Alessandra Ciappa, Ugo Matteoli, Alberto Scrivanti

Journal:

Tetrahedron: Asymmetry

Year:

2002

Language:

english

File:

PDF, 87 KB

english, 2002

14

Lifetime extrapolation for IGBT modules under realistic operation conditions

M. Ciappa, P. Malberti, W. Fichtner, P. Cova, L. Cattani, F. Fantini

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 392 KB

english, 1999

15

A New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Vezio Malandruccolo, Mauro Ciappa, Hubert Rothleitner, Wolfgang Fichtner

Journal:

Journal of Electronic Testing

Year:

2011

Language:

english

File:

PDF, 610 KB

english, 2011

16

[IEEE 19th International Symposium on Power Semiconductor Devices and IC's - Jeju, Korea (2007.05.27-2007.05.31)] Proceedings of the 19th International Symposium on Power Semiconductor Devices and IC's - Integrated Compact Modelling of a Planar-Gate Non-Punch-Through 3.3kV-1200A IGBT Module for Insightful Analysis and Realistic Interpretation of the Failure Mechanisms

Castellazzi, A., Ciappa, M., Fichtner, W., Urresti-Ibanez, J., Mermet-Guyennet, M.

Year:

2007

Language:

english

File:

PDF, 5.51 MB

english, 2007

17

Measurement and modeling of the electron impact-ionization coefficient in silicon up to very high temperatures

Reggiani, S., Gnani, E., Rudan, M., Baccarani, G., Corvasce, C., Barlini, D., Ciappa, M., Fichtner, W., Denison, M., Jensen, N., Groos, G., Stecher, M.

Journal:

IEEE Transactions on Electron Devices

Year:

2005

Language:

english

File:

PDF, 942 KB

english, 2005

18

[IEEE 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - New Orleans, LA, USA (2020.3.15-2020.3.19)] 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) - Valley skipping compensation for low THD in Constant-On-Time Control for PFC Pre-regulators: Implementation and Performance

Bianco, Alberto, Scappatura, Giuseppe, Ciappa, Francesco

Year:

2020

File:

PDF, 990 KB

2020

19

A new adaptive amplifier for biased electron beam induced current applications

M. Ciappa, P. Malberti, P. Furcas, M. Vanzi

Journal:

Microelectronics Reliability

Year:

1998

Language:

english

File:

PDF, 392 KB

english, 1998

20

Characterization of photonic devices by secondary electron potential contrast

M. Buzzo, M. Ciappa, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 1.60 MB

english, 2006

21

A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters

Vezio Malandruccolo, Mauro Ciappa, Hubert Rothleitner, M. Hommel, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.26 MB

english, 2010

22

Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Ciappa, M., Carbognani, F., Fichtner, W.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 351 KB

english, 2003

23

Electro-thermal simulation in the time domain of GaN HEMT for RF switch-mode amplifier

Satoshi Ono, Mauro Ciappa, Shigeru Hiura, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 695 KB

english, 2012

24

Perito Moreno Glacier (Argentina) flow estimation by COSMO SkyMed sequence of high-resolution SAR-X imagery

Achille Ciappa, Luca Pietranera, Fabrizio Battazza

Journal:

Remote Sensing of Environment

Year:

2010

Language:

english

File:

PDF, 4.76 MB

english, 2010

25

A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy

Maria Stangoni, Mauro Ciappa, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 883 KB

2003

26

[IEEE International Reliability Physics Symposium - Dallas, TX, USA (30 March-4 April 2003)] 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual. - Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Ciappa, M., Carbognani, F., Cova, P., Fichtner, W.

Year:

2003

Language:

english

File:

PDF, 366 KB

english, 2003

27

Monte Carlo simulation of emission site, angular and energy distributions of secondary electrons in silicon at low beam energies

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 836 KB

english, 2012

28

A Multilevel CMOS–MEMS Design Methodology Based on Response Surface Models

Sato, Norio, Sato, Yasuhiro, Kado, Yuichi, Ciappa, Mauro, Aemmer, Dölf, Kaeslin, Hubert, Fichtner, Wolfgang

Journal:

Journal of Microelectromechanical Systems

Year:

2011

Language:

english

File:

PDF, 1.40 MB

english, 2011

29

Effects of Particle Size and Density on the Packed-Bed Pyrolysis of Wood

Di Blasi, C., Branca, C., Lombardi, V., Ciappa, P., Di Giacomo, C.

Journal:

Year:

2013

Language:

english

File:

PDF, 1.42 MB

english, 2013

30

Electrothermal Characterization for Reliability of Modern Low-Voltage PowerMOSFETs

Castellazzi, Alberto, Ciappa, Mauro

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2007

Language:

english

File:

PDF, 1.02 MB

english, 2007

31

New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions

D. Barlini, M. Ciappa, A. Castellazzi, M. Mermet-Guyennet, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 368 KB

english, 2006

32

On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices

G. Mura, M. Vanzi, M. Stangoni, M. Ciappa, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.21 MB

2003

33

[IEEE Proceedings of International Reliability Physics Symposium - Dallas, TX, USA (1996.04.30-1996.05.2)] Proceedings of International Reliability Physics Symposium RELPHY-96 - Hydrogen Passivation of Boron Acceptors and Long-Term Breakdown Voltage Instability in N/sup +//P Su

Ciappa, M., Malberti, P., Birolini, A.

Year:

1996

Language:

english

File:

PDF, 662 KB

english, 1996

34

Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices

Maria Stangoni, Mauro Ciappa, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 846 KB

english, 2005

35

Characterization of the onset of carrier multiplication in power devices by a collimated radioactive alpha source

Ciappa, Mauro, Pocaterra, Marco

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.74 MB

english, 2019

36

SCR operation mode of diode strings for ESD protection

Ulrich Glaser, Kai Esmark, Martin Streibl, Christian Russ, Krzysztof Domański, Mauro Ciappa, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.41 MB

english, 2007

37

Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes

Aniello Esposito, Mauro Ciappa, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.14 MB

english, 2011

38

Unstructured tetrahedric meshes for the description of complex three-dimensional sample geometries in Monte Carlo simulation of scanning electron microscopy images for metrology applications

Ilgünsatiroglu, Emre, Illarionov, Alexey Yu., Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.12 MB

english, 2013

39

Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications

A. Castellazzi, M. Ciappa, W. Fichtner, G. Lourdel, M. Mermet-Guyennet

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 1.06 MB

english, 2006

40

A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs

A. Castellazzi, M. Ciappa, W. Fichtner, M. Piton, M. Mermet-Guyennet

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.01 MB

english, 2007

41

Thermal characterization of IGBT power modules

P. Cova, M. Ciappa, G. Franceschini, P. Malberti, F. Fantini

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 261 KB

english, 1997

42

Design of optimum electron beam irradiation processes for the reliability of electric cables used in critical applications

M. Ciappa, L. Mangiacapra, M. Stangoni, S. Ott, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

43

Monte Carlo modeling in the low-energy domain of the secondary electron emission of polymethylmethacrylate for critical-dimension scanning electron microscopy

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2010

Language:

english

File:

PDF, 343 KB

english, 2010

44

Reliability odometer for real-time and in situ lifetime measurement of power devices

Ciappa, Mauro, Blascovich, Alessandro

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 936 KB

english, 2015

45

Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast

M. Buzzo, M. Ciappa, M. Stangoni, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 626 KB

english, 2005

46

Imaging and Dopant Profiling of Silicon Carbide Devices by Secondary Electron Dopant Contrast

Buzzo, M., Ciappa, M., Fichtner, W.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2006

Language:

english

File:

PDF, 1002 KB

english, 2006

47

[IEEE 2009 14th IEEE European Test Symposium (ETS) - Sevilla, Spain (2009.05.25-2009.05.29)] 2009 14th IEEE European Test Symposium - Novel Solution for the Built-in Gate Oxide Stress Test of LDMOS in Integrated Circuits for Automotive Applications

Malandruccolo, V., Ciappa, M., Fichtner, W., Rothleitner, H.

Year:

2009

Language:

english

File:

PDF, 302 KB

english, 2009

48

Transient stressing and characterization of thin tunnel oxides

M. Ciappa, A. Naitana, M. Vanzi

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 312 KB

english, 1997

49

[IEEE 2006 IEEE International Symposium on Power Semiconductor Devices & IC's - Naples, Italy (04-08 June 2006)] 2006 IEEE International Symposium on Power Semiconductor Devices & IC's - Characterization of Unconventional Engineering Solutions for Superjunction Devices

Buzzo, M., Ciappa, M., Rueb, M., Fichtner, W.

Year:

2006

Language:

english

File:

PDF, 2.50 MB

english, 2006

50

[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - 2D junction delineation for the failure analysis of silicon carbide devices

Buzzo, M., Ciappa, M., Fichtner, W.

Year:

2005

Language:

english

File:

PDF, 972 KB

english, 2005

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